A major obstacle may be standing in the way of the next generation of ultra-tiny computer chips. Researchers discovered that many promising 2D materials lose their advantages because an invisible atomic-scale gap forms when they are combined with insulating layers. That tiny gap weakens electronic performance and could prevent further miniaturization. The team says new “zipper materials” that lock together more tightly may offer a path forward.
from All Top News -- ScienceDaily https://ift.tt/AVsYmPk
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